Ablation and cutting of silicon wafer and micro-mold fabrication using femtosecond laser pulses

Journal of Laser Applications

Volumn 19, Issue 4, 2007, Pages 240-244

  Wang, Ying ^a   Dai, Nengli ^a   Li, Yuhua ^a   Wang, Xinlin ^a   Lu, Peixiang ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Femtosecond laser; Micromachining; Mold; Silicon wafer

Indexed keywords

LASER ABLATION; LASER BEAM CUTTING; MICROFABRICATION; MICROMACHINING; MOLDS; ULTRASHORT PULSES;

CUTTING KERFS; ENERGY FLUENCE LEVEL; LASER ABLATING SPOTS; MICRO-MOLD FABRICATION;

SILICON WAFERS;

EID: 38949193510     PISSN: 1042346X     EISSN: None     Source Type: Journal    
DOI: 10.2351/1.2795754     Document Type: Article

References (12)

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