Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser

Optics and Lasers in Engineering

Volumn 35, Issue 6, 2001, Pages 361-369

  Ngoi, B K A ^a   Venkatakrishnan, K ^a   Lim, E N L ^a   Tan, B ^a   Koh, L H K ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Femtosecond laser; Laser ablation; Laser material processing; Laser micromachining; Thermal effect

Indexed keywords

MICROMACHINING; PULSED LASER APPLICATIONS; SEMICONDUCTING SILICON; THERMAL EFFECTS; ULTRAFAST PHENOMENA; ULTRASHORT PULSES;

FEMTOSECOND LASER;

LASER DAMAGE;

EID: 0035362763     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(01)00025-2     Document Type: Article

References (12)

1. Open repair technologies for MCM-D
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4. Fast 3D laser micromachining of silicon for micromechanical and microfluidic applications
5. Laser ablation and micromachining with ultrashort laser pulses
6. Femtosecond melting and ablation of semiconductors studied with time of flight mass spectroscopy
7. Short-pulse laser ablation of solid targets
8. Thermal and nonthermal melting of gallium arsenide after femtosecond laser excitation
9. Femtosecond melting and ablation of semiconductors studied with time-of-flight mass spectroscopy
10. Silicon nanostructures produced by laser direct etching