Modelling the effect of voids in anisotropic conductive adhesive joints

Soldering & Surface Mount Technology

Volumn 17, Issue 1, 2005, Pages 4-12

  Lee, K K ^a   Yeung, N H ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Bonding; Electronic engineering; Finite element analysis; Stress (materials)

Indexed keywords

ANISOTROPY; BONDING; CONDUCTIVE FILMS; ELECTRONICS ENGINEERING; EPOXY RESINS; FINITE ELEMENT METHOD; MICROELECTRONICS; MICROPROCESSOR CHIPS; STRESSES;

CONDUCTIVE PARTICLES; FLIP CHIP (FC) TECHNOLOGY; STRESS (MATERIALS); THERMOMECHANICAL ANALYSIS;

ADHESIVE JOINTS;

EID: 18844414316     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510579195     Document Type: Article

References (7)

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