Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs)

Circuit World

Volumn 29, Issue 1, 2002, Pages

  Rapala Virtanen, Tarja ^a  

^a Aspocomp Group Oyj   (Finland)

Author keywords

Manufacturing technology; Printed circuit boards

Indexed keywords

COST EFFECTIVENESS; DIELECTRIC MATERIALS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; TECHNOLOGY;

RESIN COATED COPPER FOILS;

PRINTED CIRCUIT BOARDS;

EID: 18644376683     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310444142     Document Type: Article

References (4)

1. Borland, W.J. and Felden, J.J. Thick Film Ceramic Capacitors and Resistors Inside Printed Circuit Board, DuPont Technologies.
2. Borland, W.J. and Ferguson, S. (2001), Embedded Passive Components in PWB, DuPont, Circuitree, March.
3. Nelco Technical Presentation, 2001.
4. OEM Technical Presentation (2001), Thin Film Reststors Gould, November.