Deep micro hole drilling in a silicon substrate using multi-bursts of nanosecond UV laser pulses

Journal of Micromechanics and Microengineering

Volumn 16, Issue 1, 2006, Pages 109-112

  Tan, B ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; LASER ABLATION; SILICON; SUBSTRATES; ULTRAVIOLET RADIATION; VAPORS;

ABLATED MATERIALS; DEEP MICRO HOLE DRILLING; PULSE ENERGY; SILICON SUBSTRATES;

DRILLING;

EID: 29144435323     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/1/015     Document Type: Article

References (5)

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4. Luft A, Franz U, Emsermann A and Kaspar J 1996 A study of thermal and mechanical effects on materials induced by pulsed laser drilling Appl. Phys. A 63 93-101
5. Klimentov S M, Garnov S V, Kononenko T V, Konov V I, Pivovarov P A and Dausinger F 1999 High rate deep channel ablative formation by picosecond-nanosecond combined laser pulses Appl. Phys. A 69 (suppl) s633-6