Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation

Applied Physics A: Materials Science and Processing

Volumn 90, Issue 3, 2008, Pages 457-463

  Wang, Tong Hong ^a,b   Fang, Te Hua ^c   Lin, Yu Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FILM THICKNESS; FINITE ELEMENT METHOD; NANOINDENTATION; SEMICONDUCTING SILICON;

BILAYER THICKNESSES; EQUIVALENT STRESS; THINNER MULTILAYERS;

MULTILAYERS;

EID: 37549022584     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-007-4303-3     Document Type: Article

References (19)

1. J.A. Ruud, T.R. Jervis, F. Spaepen, J. Appl. Phys. 75, 4969 (1994)
2. H.C. Barshilia, K.S. Rajam, Surf. Coat. Technol. 155, 195 (2002)
3. N.J.M. Carvalho, J.T.M. De Hosson, Acta Mater. 54, 1857 (2006)
4. G.P. Zhang, Y. Liu, W. Wang, J. Tan, Appl. Phys. Lett. 88, 013105-1 (2006)
5. A.C. Fischer-Cripps, Nanoindentation (Springer, New York, 2002)
6. J.R. Barber, D.A. Bilings, Int. J. Mech. Sci. 32, 991 (1990)
7. G.G. Bilodeau, J. Appl. Mech. 59, 519 (1992)
8. T.H. Wang, T.H. Fang, Y.C. Lin, Mater. Sci. Eng. A 447, 244 (2007)
9. T.H. Wang, T.H. Fang, Y.C. Lin, Appl. Phys. A 86, 335 (2007)
10. A.W. Bowen, P.G. Partridge, J. Phys. D Appl. Phys. 7, 969 (1973)
11. T. Li, Z.Y. Huang, Z. Suo, S.P. Lacour, S. Wagner, Appl. Phys. Lett. 85, 3435 (2004)
12. J.H. Lau, Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies (McGraw-Hill, New York, 1997)
13. S.W. Youn, C.G. Kang, Mater. Sci. Eng. A 390, 233 (2005)
14. J.L. Bucaille, S. Stauss, E. Felder, J. Michler, Acta Mater. 51, 1663 (2003)
15. D. Beegan, M.T. Laugier, Surf. Coat. Technol. 199, 32 (2005)
16. W.C. Oliver, G.M. Pharr, J. Mater. Res. 7, 1564 (1992)
17. T.H. Fang, W.J. Chang, C.I. Weng, Mater. Sci. Eng. A 430, 332 (2006)
18. T.H. Fang, W.J. Chang, Microelectron. Eng. 65, 231 (2003)
19. L.J. Gibson, M.F. Ashby, Cellular Solids: Structure and Properties (Cambridge University Press, Cambridge, 1997)