Redeposition characteristics of focused ion beam milling for nanofabrication

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 2215-2218

  De Winter, D A M ^a   Mulders, J J L ^b  

^a UTRECHT UNIVERSITY   (Netherlands)

^b Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DOPING (ADDITIVES); MILLING (MACHINING); NANOTECHNOLOGY; SPUTTER DEPOSITION; THICKNESS MEASUREMENT;

ION CURRENTS; REDEPOSITION;

FOCUSED ION BEAMS;

EID: 37149016679     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2806973     Document Type: Article

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