Quantitative thermoreflectance imaging: Calibration method and validation on a dedicated integrated circuit

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 604-608

  Tessier, Gilles ^a   Pavageau, Sabrina ^b   Charlot, Benoit ^c   Filloy, Celine ^d   Fournier, Daniele ^d   Cretin, B ^e   Dilhaire, S ^e   Gomes, S ^e   Trannoy, N ^e   Vairac, P ^e   Volz, S ^e  

^a PSL RESEARCH UNIVERSITY   (France)

^b UNIVERSITÉ DE TOULOUSE   (France)

^c Centre National de la Recherche Scientifique   (Japan)

^d SORBONNE UNIVERSITÉ   (France)

^e CNRS   (France)

Author keywords

Calibration; Charge coupled device (CCD); Charge coupled device circuits; Thermoreflectance

Indexed keywords

ALUMINUM; CALIBRATION; CHARGE COUPLED DEVICES; INFRARED IMAGING; POLYSILICON; REFLECTION; TEMPERATURE;

QUANTITATIVE THERMOREFLECTANCE IMAGING; SOFTWARE IMAGE SHIFTING; THERMOREFLECTANCE MICROSCOPE;

IMAGING TECHNIQUES;

EID: 36849087849     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898384     Document Type: Conference Paper

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