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Volumn 30, Issue 4, 2007, Pages 636-640

Hygrothermal failures from small defects in lead-free solder reflowed electronic packages

Author keywords

Delamination; Driving force; Finite element analysis; Lead; Lead free; Reflow temperature; Temperature measurement

Indexed keywords

DEFECTS; DELAMINATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; SOLDERING; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY;

EID: 36349028171     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.906228     Document Type: Article
Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.