Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 371-378

  Tay, A A O ^a   Lin, T Y ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; DEFECTS; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; MOISTURE; NETWORK COMPONENTS; TIMING CIRCUITS; DELAMINATION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); MICROSCOPIC EXAMINATION; PLASTIC PRODUCTS; SOLDERING; STRESS CONCENTRATION; STRESS INTENSITY FACTORS; TOUGHNESS;

DELAMINATION PROPAGATION; INTERFACIAL DELAMINATION; INTERNAL DELAMINATION; MOISTURE ABSORPTION; MOISTURE PRECONDITIONING; MOISTURE-INDUCED DELAMINATION; PLASTIC IC PACKAGES; SCANNING ACOUSTIC MICROSCOPES;

SOLDERING; ELECTRONICS PACKAGING;

MOISTURE INDUCED INTERFACIAL DELAMINATION GROWTH; SOLDER REFLOW;

EID: 0031620466     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678720     Document Type: Conference Paper

References (20)

1. Fukuzawa, I., Ishiguro, S., Nanbu, S., 1985 "Moisture Resistance Degradation of Plastic LST's by Reflow Soldering ", Proceedings, 23rd International Reliability Physics Symposium, pp 192-197.
2. Kitano, M., Nishimura, A., Kawai, S., 1988, "Analysis of Package Cracking during Reflow Soldering Process", Proceedings, 26, h International Reliability Physics Symposium, pp 90-95.
3. Anjoh, I, Nishi, K, Kitano, M, Yoshide, T, 1988, "Analysis of the Package Cracking Problem with Vapor Phase Reflow Soldering and Corrective Action" Brazing Soldering, pp 48-51.
4. Lin, R., Blackshear, E., Serisky, P., 1988, "Moisture Induced Package Cracking in Plastic Encapsulated Surface Mount Components During Solder Reflow Process, " Proceedings of International Reliability Physics Symposium, pp 83-89.
5. Tay, A. A. O., Tan, G. L., Lim, T. B., 1993, "A Criterion for Predicting Delamination in Plastic IC Packages, " Proceedings, International Reliability' Physics Symposium, pp. 236-243.
6. Tay, A. A. O., Tan, G. L., Lim, T. B., 1994, "Predicting Delamination in Plastic IC Packages and Determining Suitable Mold Compound Properties, " IEEE Trans. On CPMT-Part B: Advanced Packaging, vol. 17, no. 2, pp 201-208.
7. Tay, A. A. O and Lin, T. Y., 1996, " Moisture Diffusion and Heat Transfer in Plastic IC Packages", IEEE Transactions on Components, Packaging and Manufacturing Technology-. Part-A, vol. 19, no. 2, pp. 186-193.
8. Tay, A. A. O and Lin, T. Y., 1996, "Effects of Moisture and Delamination on cracking of Plastic IC Packages During Solder Reflow", Proc. 46'h Electronic Components and Technology Conference, pp 777-782.
9. Hattori, T., Sakata, S., Murakami, G., 1989, "A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices, " ASME Journal of Electronic Packaging, vol. 111, pp 243-248.
10. Lin, T. Y and Tay, A. A. O., 1997, "A J-integral Criterion for Delamination of Bi-Material Interfaces Incorporating Hygrothermal stresses", ASME EEP-Vol. 19-1, Advances in Electronic Packaging, pp 1421-1428.
11. Lin, T. Y and Tay, A. A. O., 1997, " Dynamics of Moisture Diffusion, Hygrothermal Stresses and delamination in 1. Plastic IC Packages", ASME EEP-Vol. 19-1, Advances in Electronic Packaging, pp 1429-1436.
12. Hutchinson, J. W., Suo, Z., 1992, "Mixed Mode Cracking in Layered Materials", Advances in Applied Mechanics, vol 29, pp 63-191.
13. Shin, C. F., 1991, " Cracks on Bimaterial Interfaces: Elasticity and plasticity Aspects, " Material Sci. Engng., A143, pp. 77-90.
14. Rice, J. R., 1968, "A Path Independent Integral and Approximate Analysis of Strain Concentration at Notches and Cracks", ASME Journal of Applied Mechanics, v 35, pp 379-386.
15. Malyshev, B. M., Salganik, R. L., 1965, "The Strength of Adhesive Joints Using the Theory of Cracks, " International Journal of Fracture Mechanics, v 1, pp 114-128.
16. Liechti, K. M., Chai, Y. S., 1991, "Biaxial Loading Experiments for Determining Interfacial Toughness", ASME Journal of Applied Mechanics, vol. 58, pp 680-687.
17. Liu, S., Mei, Y., Wu, T. Y., 1995, "Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity", IEEE Transactions on Components, Packaging, Manufacturing Technology-Part A, Vol. 18, No. 3, pp 618-626.
18. Tanaka, N., Nishimura, A., 1995, "Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination within Package", ASME EEP-Vol, 10-2. Advances in Electronic Packaging, pp 765-773.
19. Tay, A. A. O and Lin, T. Y., 1998, "Influence of Temperature, Humidity and Defect Location on Delamination in Plastic IC Packages", Proc. ITHERM'98.
20. Yuuki, R., Cho, S. B., 1989, "Efficient Boundary Element Analysis of Stress Intensity Factors for Interface Cracks in Dissimilar Materials, " Engineering Fracture Mechanics, Vol. 34, pp 179-188.