Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

Finite Elements in Analysis and Design

Volumn 30, Issue 1-2, 1998, Pages 65-79

  Yi, Sung ^a   Sze, Kam Yim ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HYDROMETERS; MOISTURE; PACKAGING; RESIDUAL STRESSES; THERMAL STRESS;

INTEGRATED CIRCUIT PACKAGES;

INTEGRATED CIRCUITS;

EID: 0032114697     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(98)00027-4     Document Type: Article

References (7)

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2. R.L. Shook, Moisture sensitivity characterization of plastic surface mount, devices using scanning acoustic microscopy, Proc. Int. Rel. Phys. Sym., 1992, pp. 157-168.
3. D.E. Mix, A.B. Cohen, K.T. Kumar, Finite element simulation of strain/stress fields in delaminated plastic IC packages, Proc. Advances in Electronic Packaging, 1995, pp. 539-552.
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5. L.T. Nguyen, K.L. Chen, J. Schaefer, A.Y. Kuo, G. Slenski, A new criterion for package integrity under solder reflow conditions, Proc. Elec. Comp. Tech. Conf., 1995, pp. 478-490.
6. S. Yi, Thermoviscoelastic analysis of delamination onset and free edge responsein epoxy matrix composite laminates, AIAA J. 31 (12) (1993) 2320-2328.
7. S. Yi, H.H. Hilton, Hygrothermal effects on viscoelastic responses of laminated composites, Composites Eng. UK 5 (2) (1995) 183-193.