Popcorning in fully populated and perimeter plastic ball grid array packages

Soldering and Surface Mount Technology

Volumn , Issue 22, 1996, Pages 46-50

  Munamarty, R ^a   McCluskey, P ^a   Pecht, M ^a   Yip, L ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DELAMINATION; FAILURE (MECHANICAL); FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SUBSTRATES;

ENVIRONMENTAL SCANNING ELECTRON MICROSCOPY; MICROCIRCUITS; PLASTIC BALL GRID ARRAYS; POPCORNING; REFLOW SOLDERING; SCANNING ACOUSTIC MICROSCOPY;

ELECTRONICS PACKAGING;

EID: 0030082340     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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9. Pecht, M. G., Nguyen, L. T. and Hakim, E. B., 'Plastic Encapsulated Microelectronics: Materials, Processes, Tests, Reliability, and Applications', John Wiley and Sons, New York, (1995).
10. Yalamanchili, P., Gannamani, R., Munamarty, R., McCluskey, P. and Christou, A., 'Optimum Processing Prevents PQFP Popcorning', Surface Mount Technology, pp. 39-42, May (1995).
11. Gannamani, R. and Munamarty, R., 'Techniques to Qualify PEMs against Popcorning', Electronic Materials & Packaging, pp. 24-26, November (1995).
12. IPC-SM-786A, 'Procedures for Characterizing and Handling of Moisture / Reflow Sensitive ICs', September (1994).