Popcorning - a fracture mechanics approach

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 869-874

  Kuo, A Y ^a   Chen, W T ^a   Nguyen, L T ^a   Chen, K L ^a   Slenski, G ^a  

^a Optimal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACKS; EVAPORATION; EXPERT SYSTEMS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MOISTURE; PACKAGING MATERIALS; RELIABILITY; SOLDERING; STRESS ANALYSIS; STRESS INTENSITY FACTORS;

PLASTIC ENCAPSULATED MICROCIRCUITS; PLASTIC QUAD FLAT PACKS; POPCORNING;

ELECTRONICS PACKAGING;

EID: 0029721223     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)