Investigation of lead-free package reliability: A new, reliable material is essential

Advanced Packaging

Volumn 13, Issue 8, 2004, Pages 27-29

  Lee, Jeffrey C B ^a   Li, Simon S M ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE SOLDER; MOLDING COMPOUND SELECTION; PACKAGE INTEGRITY; SOLDER BALL SELECTION;

ELECTRONICS INDUSTRY; EPOXY RESINS; LEAD; MOISTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN ALLOYS; VAPOR PRESSURE;

PACKAGING;

ELECTRONICS; LEAD; PACKAGING INDUSTRY; POLYEPOXIDES; SCANNING ELECTRON MICROSCOPY; SOLDERING; VAPOR PRESSURE; WATER ABSORPTION;

EID: 4444273184     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)