MOISTURE INDUCED PACKAGE CRACKING IN PLASTIC ENCAPSULATED SURFACE MOUNT COMPONENTS DURING SOLDER REFLOW PROCESS.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1988, Pages 83-89

  Lin, R ^a   Blackshear, E ^a   Serisky, P ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION - PLASTICS APPLICATIONS;

COMPONENT RELIABILITY; MOISTURE-INDUCED PACKAGE CRACKING; PROCESS COMPATIBILITY; SURFACE MOUNT TECHNOLOGY;

SEMICONDUCTOR DEVICES;

EID: 0023868087     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1988.362204     Document Type: Conference Paper

References (8)