Hygrothermal delaminations in lead-free solder reflow of electronic packages

Journal of Electronic Materials

Volumn 36, Issue 3, 2007, Pages 226-231

  Lam, D C C ^a   Wang, J ^a,b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b FUDAN UNIVERSITY   (China)

Author keywords

Delamination; Driving force; Evaporation; Lead free; Moisture diffusion

Indexed keywords

DRIVING FORCES; ELECTRONIC ASSEMBLY; HYGROTHERMAL DELAMINATIONS; MOISTURE DIFFUSION; SATURATED STEAM PRESSURE;

DELAMINATION; DIFFUSION; EVAPORATION; INTERFACIAL ENERGY; PRESSURE EFFECTS; SOLDERED JOINTS; STEAM; STRAIN ENERGY;

ELECTRONICS PACKAGING;

EID: 34247585232     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0088-6     Document Type: Article

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