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Volumn 1, Issue , 2006, Pages 203-208

Advanced packages and board level reliability

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INPUT OUTPUT PROGRAMS; INTERCONNECTION NETWORKS; PRINTED CIRCUIT BOARDS; RELIABILITY ANALYSIS;

EID: 42549117560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279999     Document Type: Conference Paper
Times cited : (2)

References (2)
  • 2
    • 42549163588 scopus 로고    scopus 로고
    • Anforderungen an Testmethoden zur Analyse der Zuverlässigkeit von Elektronikbaugruppen
    • Fellbach, 09.02
    • Albrecht, H.J.: Anforderungen an Testmethoden zur Analyse der Zuverlässigkeit von Elektronikbaugruppen, DVS Conference, Fellbach, 09.02.2006
    • (2006) DVS Conference
    • Albrecht, H.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.