|
Volumn 1, Issue , 2006, Pages 203-208
|
Advanced packages and board level reliability
a
SIEMENS AG
(Germany)
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ELECTRONICS PACKAGING;
INPUT OUTPUT PROGRAMS;
INTERCONNECTION NETWORKS;
PRINTED CIRCUIT BOARDS;
RELIABILITY ANALYSIS;
INTERCONNECTION TECHNOLOGY;
LEAD-FREE FINISHES;
LEAD-FREE SOLDERS;
ELECTRONIC EQUIPMENT TESTING;
|
EID: 42549117560
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESTC.2006.279999 Document Type: Conference Paper |
Times cited : (2)
|
References (2)
|