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Volumn 2005, Issue , 2005, Pages 79-85

Creep of thermally aged SnAgCu-solder joints

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; MATHEMATICAL MODELS; METALLIZING;

EID: 33745683917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502778     Document Type: Conference Paper
Times cited : (5)

References (28)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.