메뉴 건너뛰기




Volumn 2, Issue , 2006, Pages 1108-1117

Optimisation modelling for design of advanced interconnects

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER AIDED DESIGN; ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; OPTIMIZATION;

EID: 42549095514     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280148     Document Type: Conference Paper
Times cited : (2)

References (14)
  • 1
    • 42549118278 scopus 로고    scopus 로고
    • The European Parliament and the Council of the European Union, Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE), Official Journal of the European Union, February 13, (2003), pp. L 37/24-38.
    • The European Parliament and the Council of the European Union, "Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE)", Official Journal of the European Union, February 13, (2003), pp. L 37/24-38.
  • 2
    • 0037675719 scopus 로고    scopus 로고
    • Pb-free Solder Challenges in Electronic Packaging and Assembly
    • New Orleans, Louisiana, USA, June
    • Hua, F., "Pb-free Solder Challenges in Electronic Packaging and Assembly", The 53-rd IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, USA, June 2003, pp. 58-63.
    • (2003) The 53-rd IEEE Electronic Components and Technology Conference Proceedings , pp. 58-63
    • Hua, F.1
  • 4
    • 36348997828 scopus 로고    scopus 로고
    • Design, Materials, Process and Reliability of Lead-free Solders for Robust IC Electronic and Optoelectronic Packaging
    • Singapore, December
    • Lau, J. H., "Design, Materials, Process and Reliability of Lead-free Solders for Robust IC Electronic and Optoelectronic Packaging", Short Course Notes of the 5-th Electronics Packaging Technology Conference, Singapore, December 2003.
    • (2003) Short Course Notes of the 5-th Electronics Packaging Technology Conference
    • Lau, J.H.1
  • 5
    • 0036296702 scopus 로고    scopus 로고
    • Reliability Assessment of Flip-Chip Assemblies with Lead-Free Solder Alloys
    • San Diego, CA, USA, May
    • Shubert, A., et al, "Reliability Assessment of Flip-Chip Assemblies with Lead-Free Solder Alloys", The 52-th IEEE Electronic Components and Technology Conference Proceedings, San Diego, CA, USA, May 2003, pp. 1246-1255.
    • (2003) The 52-th IEEE Electronic Components and Technology Conference Proceedings , pp. 1246-1255
    • Shubert, A.1
  • 10
    • 0033667067 scopus 로고    scopus 로고
    • Solders as High Temperature Engineering Materials
    • Plumbridge, W. J., "Solders as High Temperature Engineering Materials", Materials at High Temperatures, Vol. 17, No. 3 (2000), pp. 381-387.
    • (2000) Materials at High Temperatures , vol.17 , Issue.3 , pp. 381-387
    • Plumbridge, W.J.1
  • 11
    • 42549094312 scopus 로고    scopus 로고
    • PHYSICA, Multiphysics Software Ltd, London
    • PHYSICA, Multiphysics Software Ltd, London, 2000, http://www.multi- physics.com
    • (2000)
  • 12
    • 10444236402 scopus 로고    scopus 로고
    • Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints
    • Las Vegas, Nevada, USA, June
    • Syed, A. (2004), "Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints", The 54-th Electronic Components and Technology Conference Proceedings, Las Vegas, Nevada, USA, June 2004, pp. 737-746.
    • (2004) The 54-th Electronic Components and Technology Conference Proceedings , pp. 737-746
    • Syed, A.1
  • 13
    • 42549093364 scopus 로고    scopus 로고
    • VR&D VisualDOC (Version 5.1) - Theoretical Manual (http://www.vrand.com)
    • VR&D VisualDOC (Version 5.1) - Theoretical Manual (http://www.vrand.com)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.