Suppression of EMI and electromagnetic noise in packages using embedded capacitance and miniaturized electromagnetic bandgap structures with high-k dielectrics

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 4, 2007, Pages 776-788

  Mohajer Iravani, Baharak ^a,b   Ramahi, Omar M ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Electromagnetic interference (EMI) suppression; High k dielectric; Integrated circuit (IC) packages; Meander line; Microprocessor package; Miniaturization; Planar EBG structure

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; DIELECTRIC MATERIALS; INTERFERENCE SUPPRESSION; MICROPROCESSOR CHIPS; NATURAL FREQUENCIES; PERMITTIVITY; SIGNAL INTERFERENCE;

ELECTROMAGNETIC BANDGAP STRUCTURES; EMBEDDED CAPACITANCE; HIGH-K DIELECTRICS; INTEGRATED CIRCUIT (IC) PACKAGES; MICROPROCESSOR PACKAGE;

ELECTRONICS PACKAGING;

EID: 36348963726     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.908028     Document Type: Article

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