Package-level implementation of multiband electromagnetic band-gap structures

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2006, Pages 598-601

  Kamgaing, Telesphor ^a   Jiangqi, He ^a   Rockwell, Hsu ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Electromagnetic band gap structures; Parallelplate waveguides; RF analog mixed signal; Signal isolation

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FREQUENCY BANDS; OPTIMIZATION; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTROMAGNETIC SIMULATION; MULTIBAND ELECTROMAGNETIC BAND GAP STRUCTURES;

ENERGY GAP;

EID: 34250359870     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2006.249665     Document Type: Conference Paper

References (7)

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