A novel overlay process for imprint lithography using load release and alignment error pre-compensation method

Microelectronic Engineering

Volumn 85, Issue 1, 2008, Pages 168-174

  Shao, Jinyou ^a   Ding, Yucheng ^a   Tang, Yiping ^a   Liu, Hongzhong ^a   Lu, Bingheng ^a   Cui, Dongyin ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Alignment; Imprint lithography; Load release; Overlay; Pre compensation

Indexed keywords

ALIGNMENT; COST EFFECTIVENESS; ENERGY EFFICIENCY; ERROR ANALYSIS; LITHOGRAPHY;

IMPRINT LITHOGRAPHY; LOAD RELEASE; OVERLAY; PATTERN TRANSFER; PRE-COMPENSATION METHODS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 36249032597     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.004     Document Type: Article

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