Distortion reduction by load release for imprint lithography

Microelectronic Engineering

Volumn 83, Issue 3, 2006, Pages 485-491

  Li, Hansong ^a   Ding, Yucheng ^a   Tang, Yiping ^a   Liu, Hongzhong ^a   Lu, Bingheng ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Distortion; Elastomeric mould; Imprint process; Photo curable resist

Indexed keywords

ELASTOMERS; LIGHT SOURCES; LITHOGRAPHY; MOLDING; SIGNAL DISTORTION; X RAY ANALYSIS;

DISTORTION; ELASTOMERIC MOULD; IMPRINT PROCESS; PHOTO-CURABLE RESIST;

ELECTRIC LOADS;

EID: 33244462834     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.11.013     Document Type: Article

References (15)

1. I. Toshiro, S. Toshifumi, and W. Wataru Microelectron. Eng. 73 & 74 2004 11 15
2. S.Y. Chou, P.R. Krauss, and P.J. Renstrom Appl. Phys. Lett. 67 1995 3114 3116
3. S.Y. Chou, Lei Zhuang, and Linjie Guo Appl. Phys. Lett. 75 1999 1004 1006
4. Y.S. Kim, K.Y. Suh, and Hong H. Lee Appl. Phys. Lett. 79 2001 2285 2287
5. J.A. Rogers, K.E. Paul, R.J. Jackman, and G.M. Whitesides Appl. Phys. Lett. 70 1997 2658 2660
6. P.R. Krauss, and S.Y. Chou Appl. Phys. Lett. 71 1997 3174 3176
7. S. Zhang, J.E. Franke, T.M. Niemczyk, D.M. Haaland, J.N. Cox, and I. Banerjee J. Vac. Sci. Technol. B 15 1997 955 960
8. U. Plachetka, M. Bender, A. Fuchs, B. Vratzov, T. Glinsner, F. Linder, and H. Kurz Microelectron. Eng. 73-74 2004 167 171
9. S.Y. Chou, and P.R. Krauss Microelectron. Eng. 35 1997 237 240
10. N. Roos, H. Schulz, and L. Bendfeldt Microelectron. Eng. 61-62 2002 399 405
11. I. Maximov, E.-L. Sarwe, and M. Beck Microelectron. Eng. 61-62 2002 449 454
12. W.M. Choi, and O. Ok Park Microelectron. Eng. 73-74 2004 178 183
13. L.J. Heyderman, H. Schift, C. David, J. Gobrecht, and T. Schweizer Microelectron. Eng. 54 2000 229 245
14. H.-C. Scheer, and H. Schulz Microelectron. Eng. 56 2001 331 332
15. Liu Hongzhong, Lu Bingheng, Ding Yucheng, Tang Yiping, and Li Dicheng J. Micromech. Microeng. 13 2 2003 295 299