Growth of electrolytic copper dendrites and their adhesion to an epoxy resin

Surface and Coatings Technology

Volumn 106, Issue 1, 1998, Pages 44-52

  Sun, Byung K ^a   O'Keefe, Thomas J ^b  

^a Samsung Electromechanics America   (United States)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Adhesion strength; Copper microdendrite; Deposit morphology; Limiting current density

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); COPPER; CURRENT DENSITY; EPOXY RESINS; FAILURE (MECHANICAL); METALLIC FILMS; METALLIZING; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SPECTROMETRY;

COPPER DENDRITES; ENERGY DISPERSIVE SPECTROMETRY (EDS); PEEL TESTS;

ELECTRODEPOSITION;

EID: 0032115909     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(98)00488-5     Document Type: Article

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