Multilayered metal capping barrier including CuSiN, for sub- 65-nm technology nodes

Journal of Applied Physics

Volumn 102, Issue 7, 2007, Pages

  Liu, B ^a   Xu, K W ^a   Song, Z X ^a   Bell, T ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER COMPOUNDS; DIFFUSION; INTERFACES (MATERIALS); THERMAL EFFECTS; ULTRATHIN FILMS;

BARRIER HERMETICITY; BARRIER STACKS; CAPPING BARRIERS; DIELECTRIC BARRIER; INTERFACIAL ADHESION;

MULTILAYER FILMS;

EID: 35348909559     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2786673     Document Type: Article

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