Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects

Volumn , Issue , 2004, Pages 17-20

  Farcy, A ^a   Cueto, O ^b   Blampey, B ^c   Lacrevaz, T ^a,c   Flechet B ^c   De Crecy F ^b   Torres, J ^a  

^a STMICROELECTRONICS   (France)

^b CEA GRENOBLE   (France)

^c UNIVERSITÉ DE SAVOIE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CROSSTALK; ELECTROMAGNETIC FIELDS; ELECTROMAGNETIC WAVES; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; OPTIMIZATION; TIME DOMAIN ANALYSIS; TRANSISTORS;

CAPACITIVE CROSSTALK; DOMAIN EXTRACTION; PROCESS PARAMETERS; SIMULATION TOOLS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 10044243811     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. Havemann R.H. et al, "High-performance interconnects: an integration overview", Proc. of the IEEE, vol. 86, No. 5, pp. 586-601, May 2001
3. Charlet F. et al, "Extraction of (R,L,C,G) interconnect parameters in 2D transmission lines using fast and efficient numerical tools", Proc. of SISPAD, Seattle, 2000
4. 2 interconnects in time and frequency domains", Proc. of AMC, San Diego, pp. 19-24, 2000
5. Bermond C. et al, "Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects", Proc. of IITC 2002, pp. 161-163, San Francisco
6. Guillaumond J.F. et al, "Analysis of resistivity in nano-interconnect: full range (4.2-300K) temperature characterization", Proc. of IITC 2003, pp. 162-164, San Francisco