High-density packaging for mobile terminals

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 3, 2004, Pages 467-475

  Pienimaa, Seppo ^a   Martin, Nigel ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; DIGITAL INTEGRATED CIRCUITS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MOBILE RADIO SYSTEMS; RELIABILITY; SOLDERED JOINTS; TRANSCEIVERS;

DIGITAL PART; FLIP CHIP INTEGRATED PASSIVE DEVICES; HIGH DENSITY PACKAGING; MINIATURIZATION; MOBILE TERMINALS; PASSIVE INTEGRATION; SINGLE CHIP PACKAGING;

ELECTRONICS PACKAGING;

EID: 7244242205     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831821     Document Type: Article

References (6)

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5. A. Chalaka, "Future trends of integrated passives," in 19th Capacitor and Resistor Technol. Symp., 1999, pp. 177-179.
6. J. Rector, "Economic and technical viability of integral passives," in IEEE Electronics Components and Technol. Conf., 1998, pp. 218-224.