Embedded thin film capacitors - Theoretical limits

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 3, 2002, Pages 454-458

  Jain, Pushkar ^a   Rymaszewski, Eugene J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Breakdown field; Capacitance density; Design space; Embedded capacitors; Tantalum pentoxide; Thin films

Indexed keywords

CAPACITORS; ELECTRIC BREAKDOWN; ELECTRONICS PACKAGING; TANTALUM COMPOUNDS;

EMBEDDED CAPACITORS;

THIN FILM DEVICES;

EID: 0036706219     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.806800     Document Type: Conference Paper

References (18)

1. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook, 2nd ed. New York: Chapman and Hall, 1997, vol. 2, ch. 9.
2. R. R. Tummala, Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001, pp. 422-464.
3. R. C. Frye, "Integrated passive components: Technologies, materials and design," Int. J. Electron. Packag., vol. 20, no. 4, pp. 578-586, 1997.
4. R. R. Tummala, G. E. White, V. Sundaram, and S. Bhattacharyam, "SOP microelectronics for the 21st century with integral passive integration," Adv. Microelectron., vol. 27, no. 1, pp. 13-18, 2000.
5. J. N. Humenik, J. M. Oberschmidt, L. L. Wu, and S. G. Paull, "Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors," IBM J. Res. Develop., vol. 36, no. 5, pp. 935-942, Sept. 1992.
6. R. Dowining, P. Gebler, and G. Katopis, "Decoupling capacitor effects on switching noise," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, pp. 484-489, Aug. 1993.
7. M. P. Goetz, "Time and frequency domain analysis of integral decoupling capacitors," IEEE Trans. Comp., Packag., Manufact. Technol. B., vol. 19, pp. 518-522, Aug. 1996.
8. P. Cahl, R. R. Tummala, G. Alien, and M. Swaminathan, "A novel integrated decoupling capacitor for MCM-L technology." IEEE Trans. Comp., Packag., Manufact. Technol. B., vol. 21, pp. 184-193, May 1998.
9. P. Jain, J. Y. Kim, Y. Xiao, R. Natarajan, E. J. Rymaszewski, R. J. Gutmann, and T. P. Chow, "Integrated thin film capacitors," in Proc. CPES Annu. Rev., Blacksburg, VA, 2000, pp. 155-158.
10. J.-Y. Kim, A. Garg, E. J. Rymaszewski, and T.-M. Lu, "High frequency Response of amorphous tantalum oxide thin films," IEEE Trans. Comp. Packag. Technol., vol. 24, pp. 526-533, Sept. 2001.
11. K. Chen, M. Nielsen, S. Soss, E. J. Rymaszewski, T.-M. Lu, and C. Wan, "Study of tantalum oxide thin film capacitors on metallized polymer sheets for advanced packaging applications," IEEE Trans. Comp., Packag., Manufact. Technol. B., vol. 20, pp. 293-302, May 2000.
12. 5 films deposited by reactive pulsed direct-current magnetron sputtering," J. Appl. Phys., vol. 87, no. 3, pp. 1448-1452, Feb. 2000.
13. J.-Y. Kim, "The deposition and characterization of high dielectric constant films prepared by pulsed reactive magnetron sputtering technique," Ph.D. dissertation. Rensselaer Polytech. Inst., Troy, NY, 2000.
14. M. C. Nielsen, "Reactive pulsed DC magnetron sputtered tantalum oxide thin films," Ph.D. dissertation, Rensselaer Polytech. Inst., Troy, NY, 1998.
15. R. W. Berry, P. M. Hall, and M. T. Harris, Thin Film Technology. Princeton, NJ: D. Van Nostrand Co., Inc., 1968, ch. 8, pp. 380-389.
16. L. I. Maissel and R. Glang, Handbook of Thin Film Technology (reissue), 1st ed. New York: McGraw-Hill, 1983, ch. 16, pp. 21-33.
17. H. S. Nalwa, Handbook of Low and High Dielectric Constant Materials and Their Applications, 1 st ed. New York: Academic, 1999, vol. 2, pp. 138-188.
18. 5) thin films for advanced dielectric applications," Mater. Sci. Eng., vol. 22, pp. 269-322, 1998.