Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 90-98

  Ahn, Seungyoung ^a   Lee, Junho ^a   Lee, Junwoo ^a   Kim, Jonghoon ^a   Ryu, Woonghwan ^a   Kum, Byung Hun ^b   Choi, Hyun Seok ^b   Yoon, Chong K ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Glotech Inc   (South Korea)

Author keywords

Equivalent circuit model; GHz frequency; High density package; Multiple line grid array (MLGA); S parameter measurement; TDR TDT

Indexed keywords

CAPACITANCE MEASUREMENT; DIELECTRIC DEVICES; ELECTRIC FREQUENCY MEASUREMENT; ELECTRIC INSULATORS; ELECTRIC NETWORK ANALYSIS; EQUIVALENT CIRCUITS; INDUCTANCE MEASUREMENT; MICROWAVE MEASUREMENT; OPTIMIZATION; SCATTERING PARAMETERS;

DIELECTRIC INSULATOR; ELECTRICAL CIRCUIT MODEL; HIGH FREQUENCY ELECTRICAL MODEL; MULTIPLE LINE GRID ARRAY INTERPOSER; PARASITIC CAPACITANCE; PARASITIC INDUCTANCE;

SEMICONDUCTOR DEVICE MODELS;

EID: 0038279767     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811554     Document Type: Article

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