Prediction of organic low-k material etching in two frequency capacitively coupled plasma

Plasma Physics and Controlled Fusion

Volumn 48, Issue 12 B, 2006, Pages

  Ishihara, K ^a   Shimada, T ^a   Yagisawa, T ^a   Makabe, T ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE SPECIES; CAPACITIVELY COUPLED PLASMAS; ETCH RATES; INTER-LAYER DIELECTRICS; LOW-K MATERIALS; MIXTURE RATIO; NUMERICAL MODELS; ORGANIC LOW-K; PLASMA CONDITIONS; PROFILE EVOLUTION; TRANSMISSION TIME;

DIELECTRIC MATERIALS; INDUCTIVELY COUPLED PLASMA;

ETCHING;

EID: 35148883866     PISSN: 07413335     EISSN: 13616587     Source Type: Journal    
DOI: 10.1088/0741-3335/48/12B/S10     Document Type: Article

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