Modeling of N2-H2 capacitively coupled plasma for low-k material etching

IEEE Transactions on Plasma Science

Volumn 32, Issue 2 I, 2004, Pages 390-398

  Shon, Chae Hwa ^a   Makabe, Toshiaki ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EXCITED NEUTRAL SPECIES; INTERMETAL DIELECTRIC MATERIALS; RELAXATION CONTINUUM MODELING; STEADY STATE PLASMA; TWO FREQUENCY CAPACITIVELY COUPLED PLASMA;

DIELECTRIC MATERIALS; DIELECTRIC RELAXATION; GROUND STATE; HYDROGEN; MATHEMATICAL MODELS; MIXTURES; MOLECULAR VIBRATIONS; NITROGEN; PLASMA DENSITY; PLASMA INTERACTIONS; PLASMA SIMULATION; TRANSPORT PROPERTIES;

PLASMA ETCHING;

EID: 4344568611     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2004.828121     Document Type: Article

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