Self-consistent modeling of feature profile evolution in plasma etching and deposition

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 45, Issue 4-7, 2006, Pages

  Shimada, Takashi ^a   Yagisawa, Takashi ^a   Makabe, Toshiaki ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

Competitive process; Feature profile evolution; Plasma process; SiO2 etching; Surface charging

Indexed keywords

ETCHING; NATURAL FREQUENCIES; SILICA; SURFACE PHENOMENA;

COMPETITIVE PROCESS; FEATURE PROFILE EVOLUTION; PLASMA PROCESS; SURFACE CHARGING;

PLASMAS;

EID: 32044460156     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.L132     Document Type: Article

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