Atomic force microscope based nanofabrication of master pattern molds for use in soft lithography

Applied Physics Letters

Volumn 91, Issue 12, 2007, Pages

  Johannes, Matthew S ^a,b,c   Cole, Daniel G ^b,c   Clark, Robert L ^c  

^a Duke University   (United States)

^b DUKE UNIVERSITY   (United States)

^c University of Pittsburgh   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; ATOMIC FORCE MICROSCOPY; MOLDS; NANOTECHNOLOGY;

ALKANETHIOLS; ANISOTROPIC WET ETCHING; MICROCONTACT PRINTING; PARALLEL PATTERNING ABILITIES;

LITHOGRAPHY;

EID: 34648818991     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2787965     Document Type: Article

References (25)

1. Y. N. Xia and G. M. Whitesides, Annu. Rev. Mater. Sci. 28, 153 (1998).
2. B. D. Gates, Q. Xu, M. Stewart, D. Ryan, C. G. Willson, and G. M. Whitesides, Chem. Rev. (Washington, D.C.) 105, 1171 (2005).
3. A. Kumar and G. M. Whitesides, Appl. Phys. Lett. 63, 2002 (1993).
4. D. Stievenard and B. Legrand, Prog. Surf. Sci. 81, 112 (2006).
5. M. S. Johannes, D. G. Cole, and R. L. Clark, Proceedings of the ASME International Mechanical Engineering Congress, Anaheim, 2004 (unpublished).
6. K. S. Salaita, S. W. Lee, D. S. Ginger, and C. A. Mirkin, Nano Lett. 6, 2493 (2006).
7. D. L. Kendall, Appl. Phys. Lett. 26, 195 (1975).
8. K. E. Bean, IEEE Trans. Electron Devices 25, 1185 (1978).
9. F. S.-S. Chien, C.-L. Wu, Y.-C. Chou, T. T. Chen, S. Gwo, and W.-F. Hsieh, Appl. Phys. Lett. 75, 2429 (1999).
10. M. S. Johannes, J. F. Kuniholm, D. G. Cole, and R. L. Clark, IEEE. Trans. Autom. Sci. Eng. 3, 236 (2006).
11. M. S. Johannes, D. G. Cole, and R. L. Clark, Appl. Phys. Lett. 90, 103106 (2007).
12. W. C. Moon, T. Yoshinobu, and H. Iwasaki, Jpn. J. Appl. Phys., Part 1 41, 4754 (2002).
13. B. Legrand, D. Deresmes, and D. Stievenard, J. Vac. Sci. Technol. B 20, 862 (2002).
14. T. Baum and D. J. Schiffrin, J. Micromech. Microeng. 7, 338 (1997).
15. H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgartel, J. Electrochem. Soc. 137, 3612 (1990).
16. P. A. Fontaine, E. Dubois, and D. Stievenard, J. Appl. Phys. 84, 1776 (1998).
17. H. J. Dai, N. Franklin, and J. Han, Appl. Phys. Lett. 73, 1508 (1998).
18. E. Delamarche, H. Schmid, B. Michel, and H. Biebuyck, Adv. Mater. (Weinheim, Ger.) 9, 741 (1997).
19. H. Schmid and B. Michel, Macromolecules 33, 3042 (2000).
20. T. W. Odom, J. C. Love, D. B. Wolfe, K. E. Paul, and G. M. Whitesides, Langmuir 18, 5314 (2002).
21. G. P. Lopez, H. A. Biebuyck, and G. M. Whitesides, Langmuir 9, 1513 (1993).
22. E. Delamarche, H. Schmid, A. Bietsch, N. B. Larsen, H. Rothuizen, B. Michel, and H. Biebuyck, J. Phys. Chem. B 102, 3324 (1998).
23. R. B. A. Sharpe, D. Burdinski, J. Huskens, H. J. W. Zandvliet, D. N. Reinhoudt, and B. Poelsema, Langmuir 20, 8646 (2004).
24. R. B. Bass and A. W. Lichtenberger, Appl. Surf. Sci. 226, 335 (2004).
25. H. Kang, J. Lee, J. Park, and H. H. Lee, Nanotechnology 17, 197 (2006).