Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1658-1662

  Yew, Ming Chih ^a   Chou, Chan Yen ^a   Chiang, Kuo Ning ^a  

^a Advanced Packaging Research Center   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUFFER LAYERS; FINITE ELEMENT METHOD; RELIABILITY ANALYSIS; SHEAR STRENGTH;

BALL SHEAR STRENGTH TESTS; SOLDER ON POLYMER (SOP) STRUCTURES; THERMOMECHANICAL BEHAVIOR;

SOLDERING ALLOYS;

EID: 34548665734     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.043     Document Type: Article

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