Modeling thermo-mechanical reliability of bumpless flip chip package

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 421-426

  Che, F X ^a   Low, T H ^a   Pang, John H L ^a   Lin, Charles W C ^b   Chiang, Sam C L ^b   Yang, T K Andrew ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Bridge Semiconductor Corporation   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD-LEVEL ASSEMBLY; BUMPLESS FLIP CHIP PACKAGE (BFCP); ELASTIC ENERGY; UNDER-BUMP METALLIZATION (UBM);

ELECTROPLATING; FINITE ELEMENT METHOD; RELIABILITY; STRAIN; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

CHIP SCALE PACKAGES;

EID: 10444227276     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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12. th ECTC, Las Vegas, Nevada, May 2000