Thermo-mechanical design of resilient contact systems for wafer level packaging

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Dudek, Rainer ^a   Walter, Hans ^a   Doering, Ralf ^a   Michel, Bernd ^a   Meyer, Thorsten ^b   Zapf, Joerg ^c   Hedler, Harry ^b  

^a FRAUNHOFER IZM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

METAL STRAINING; THERMAL MISMATCH DEFORMATION; WAFER LEVEL PACKAGING (WLP); WAFER LEVEL TEST;

GRAIN SIZE AND SHAPE; OPTICAL INTERCONNECTS; SILICON WAFERS; SOLDERED JOINTS; STRAIN; THERMAL CYCLING;

ELECTRONICS PACKAGING;

EID: 33847126589     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644012     Document Type: Conference Paper

References (4)

1. Meyer, Th., H. Hedler, W. Leiberg, "Resilient Wafer Level Packaging - a New Packaging Platform for Memory Products", Proc. Semicon 2004, pp.
2. Dudek, R., Walter, H., Döring, R., Michel, B., "Thermal Fatigue Modelling for SnAgCu and SnPb Solder Joints", Proceedings EuroSimE 2004, Brussels, Belgium, May 2004, pp. 557-564
3. Hommel, M., Kraft, O., "Deformation Behavior of Thin Copper Films on Deformable Sub-strates," Acta mater., 49 (2001), pp. 3925-3947
4. th EuroSimE, Aix, 2003, pp.133-139