Improvements of solder ball shear strength of a wafer-level CSP using a novel Cu stud technology

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 373-382

  Chang, Kuo Chin ^a   Chiang, Kuo Ning ^b  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COMPUTATIONAL METHODS; COMPUTER SIMULATION; COPPER; ELASTIC MODULI; ELECTRONICS INDUSTRY; FINITE ELEMENT METHOD; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE TESTING; SHEAR STRENGTH; SOLDERING ALLOYS;

ADVANCED ELECTRONIC PACKAGES; COPPER STUD TECHNOLOGY; NONLINEAR FINITE ELEMENT METHOD; PACKAGE RELIABILITY TESTING; SOLDER BALL; WAFER LEVEL CHIP SCALE PACKAGES;

CHIP SCALE PACKAGES;

EID: 3242787228     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828557     Document Type: Article

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