Deposition of Cu-Ag alloy film by supercritical fluid deposition

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 45, Issue 46-50, 2006, Pages

  Zhao, Bin ^a   Momose, Takeshi ^a   Shimogaki, Yukihiro ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Cu Ag alloy; Interconnects; Seed layer; Supercritical fluid deposition

Indexed keywords

DEPOSITION; FLUID DYNAMICS; MICROELECTRONICS; OPTICAL INTERCONNECTS; THIN FILMS; X RAY DIFFRACTION;

CU-AG ALLOYS; SEED LAYERS; SUPERCRITICAL FLUID DEPOSITION;

COPPER ALLOYS;

EID: 34547889542     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.L1296     Document Type: Article

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