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Japanese Journal of Applied Physics, Part 2: Letters

Volumn 44, Issue 37-41, 2005, Pages

Effects of Ag addition on the resistivity, texture and surface morphology of Cu metallization

(3) Zhao, Bin a Kim, Hoon a Shimogaki, Yukihiro a

a UNIVERSITY OF TOKYO (Japan)

Author keywords

Cu Ag alloy film; Interconnect; Resistivity; Surface morphology; Texture

Indexed keywords

COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; METALLIZING; MORPHOLOGY; SURFACES; TEXTURES;

CU-AG ALLOY FILM; INTERCONNECT; TAN SUBSTRATE; TEXTURE;

SILVER;

EID: 32044464776 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.44.L1278 Document Type: Article

Times cited : (25)

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