The study of initial mechanism for Al-Au solid phase diffusion flip-chip bonding

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 6 A, 1997, Pages 3655-3661

  Iida, Atsuko ^a   Nakamura, Shin Ichi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Al columnar microcrystal structure; Al Au solid phase diffusion; Intermetallic compound formation; Thin film

Indexed keywords

ALUMINUM GOLD SOLID PHASE DIFFUSION; COLUMNAR MICROCRYSTAL STRUCTURE; INTERMETALLIC COMPOUND FORMATION;

ALUMINUM; CHEMICAL BONDS; CRYSTAL MICROSTRUCTURE; DIFFUSION; ELECTROCHEMICAL ELECTRODES; GOLD; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERMETALLICS; MATHEMATICAL MODELS;

SEMICONDUCTING FILMS;

EID: 0031167253     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.3655     Document Type: Article

References (9)

1. K. Hatada, H. Fujimoto, T. Ochi and Y. Ishida: IEEE Trans. Comp. Hybrids Manuf. Technol. 13 (1990) 521.
2. Y. Kizaki, M. Mori and M. Saito: Proc. Japan Int. Electronic Manuf. Technol Symp., IEEE, Omiya, 1995, (1995) p. 105.
3. Y. Mizuwasa, A. Iida, Y. Kizaki and M. Mori: Proc. 9th Int. Microelectronics Conf., Omiya, 1996, p. 97.
4. A. Ishizaka, S. Iwata, H. Yamamoto: J. Jpn. Inst. Met. 41 (1977) 1154.
5. H. Haji, K. Miyoshi, T. Morita, H. Nakajima and H. Yoshida: J. Jpn. Inst. Met. 56 (1992) 355.
6. A. Tsuge, K. Mizuno, T. Uno and K. Tatsumi: J. Jpn. Inst. Met. 59 (1995) 1095.
7. G. Majni, C. Nobili, G. Ottaviani and M. Costato: J. Appl. Phys. 52 (1981) 4047.
8. H. Kato: Jpn. J. Appl. Phys. 26 (1987) 1786.
9. A. Iida and S. Nakamura: Jpn. J. Appl. Phys. 35 (1996) L335.