|
Volumn , Issue , 2000, Pages 48-51
|
Influence of processing parameters on electrical insulation properties for epoxy-resin materials - an investigation by experiment and finite element analysis simulation
a a a a
a
SIEMENS AG
(Germany)
|
Author keywords
[No Author keywords available]
|
Indexed keywords
COMPUTER SIMULATION;
CRACKS;
ELECTRIC POTENTIAL;
ELECTRODES;
EPOXY RESINS;
FINITE ELEMENT METHOD;
HEATING;
PARTIAL DISCHARGES;
STRESSES;
THERMAL EFFECTS;
THERMAL EXPANSION;
FINITE ELEMENT ANALYSIS SIMULATION;
MECHANICAL STRESS;
SOLID EPOXY MATERIALS;
TUNGSTEN NEEDLE;
ELECTRIC INSULATION;
|
EID: 0033702411
PISSN: 01642006
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
|
References (4)
|