Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1674-1680

  Tran, Tu Anh ^a   Yong, Lois ^a   Williams, Bill ^b   Chen, Scott ^c   Chen, Audi ^c  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

^c Advanced Semiconductor Engineering (ASE)   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; SEMICONDUCTING SILICON; SURFACES; TECHNOLOGY;

ALUMINUM CAPPED COPPER BOND PAD; FINE PITCH PROBING; WIREBONDING;

ELECTRON DEVICE MANUFACTURE;

EID: 0034482691     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)