Effect of mold resin on reliability in gold-aluminum bonding

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 338-344

  Imasato, E ^a   Araki, M ^a   Shimizu, I ^a   Ohno, Y ^a  

^a KUMAMOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANNEALING; BONDING; CORROSION; GOLD; GROWTH (MATERIALS); LSI CIRCUITS; PLASTICS MOLDING; RESINS; SEMICONDUCTING INTERMETALLICS; THERMAL EFFECTS;

INTERMETALLIC LAYER GROWTH;

ELECTRONICS PACKAGING;

EID: 0032230556     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)