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Volumn , Issue , 2006, Pages 182-187

Design tools for reliability analysis

Author keywords

Design in reliability; EM; HCI; NBTI; Reliability simulation

Indexed keywords

COMPUTER SIMULATION; DESIGN AIDS; HUMAN COMPUTER INTERACTION; RELIABILITY;

EID: 34547200179     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1146909.1146960     Document Type: Conference Paper
Times cited : (35)

References (16)
  • 1
    • 0005932803 scopus 로고    scopus 로고
    • New phenomena in device reliability physics of advanced CMOS submicron technologies
    • G. L. Rosa, et al., "New phenomena in device reliability physics of advanced CMOS submicron technologies," IRPS Tutorial, 2001.
    • (2001) IRPS Tutorial
    • Rosa, G.L.1
  • 2
    • 0014630193 scopus 로고    scopus 로고
    • Electromigration failure models in aluminum metallization for semiconductor devices
    • J. R. Black, "Electromigration failure models in aluminum metallization for semiconductor devices," Proceedings of the IEEE, vol. 57(9), p. 1587-1969.
    • Proceedings of the IEEE , vol.57 , Issue.9 , pp. 1587-1969
    • Black, J.R.1
  • 3
    • 85165844037 scopus 로고    scopus 로고
    • +/RelXpert/UltraSim tools, www.cadence.com.
    • +/RelXpert/UltraSim tools, www.cadence.com.
  • 4
    • 85165854878 scopus 로고    scopus 로고
    • C Hu, et al, IEEE Trans. Electron Devices, Hot-electron induced MOSFET degradation - model, monitor, improvement, ED-32, p.375, 1985.
    • C Hu, et al, IEEE Trans. Electron Devices, "Hot-electron induced MOSFET degradation - model, monitor, improvement," vol. ED-32, p.375, 1985.
  • 6
    • 0842309776 scopus 로고    scopus 로고
    • Universal recovery behavior of negative bias temperature instability
    • S. Rangan, et al, "Universal recovery behavior of negative bias temperature instability," IEDM Tech. Dig., p.341, 2003.
    • (2003) IEDM Tech. Dig , pp. 341
    • Rangan, S.1
  • 7
    • 85165835187 scopus 로고    scopus 로고
    • B. W. McGaughy, et al., Meeting the challenges of hot carrier modeling and simulation for the VDSM era, TCAD, 1999.
    • B. W. McGaughy, et al., "Meeting the challenges of hot carrier modeling and simulation for the VDSM era," TCAD, 1999.
  • 8
    • 4143069238 scopus 로고    scopus 로고
    • Build-in reliability analysis for circuit design in the nanometer technology era
    • Zhihong Liu, et al, "Build-in reliability analysis for circuit design in the nanometer technology era," ICICDT, 2004.
    • (2004) ICICDT
    • Liu, Z.1
  • 9
    • 29244437184 scopus 로고    scopus 로고
    • NBTI degradation and its impact for analog circuit reliability
    • N. K. Jha, et al., "NBTI degradation and its impact for analog circuit reliability," IEEE Trans. Electron Devices, vol.52, p.2609, 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , pp. 2609
    • Jha, N.K.1
  • 10
    • 0027624892 scopus 로고
    • Circuit design guidelines for n-channel MOSFET hot carrier robustness
    • K. R. Mistry, et al., "Circuit design guidelines for n-channel MOSFET hot carrier robustness," IEEE Trans. Electron Devices, vol.40, p. 1284, 1993.
    • (1993) IEEE Trans. Electron Devices , vol.40 , pp. 1284
    • Mistry, K.R.1
  • 11
    • 0032276824 scopus 로고    scopus 로고
    • Ratio based hot-carrier degradation modeling for aged timing simulation of millions of transistors digital circuits
    • H. Yonezawa, et al, "Ratio based hot-carrier degradation modeling for aged timing simulation of millions of transistors digital circuits" IEDM Tech. Dig., p.93, 1998.
    • (1998) IEDM Tech. Dig , pp. 93
    • Yonezawa, H.1
  • 12
    • 0942277277 scopus 로고    scopus 로고
    • An introduction to Cu electromigration
    • February, 11
    • C. S. Hau-Riege, "An introduction to Cu electromigration", Microelectronics Reliability, Volume 44, Number 2, February 2004, pp. 195-205(11).
    • (2004) Microelectronics Reliability , vol.44 , Issue.2 , pp. 195-205
    • Hau-Riege, C.S.1
  • 15
    • 0037230705 scopus 로고    scopus 로고
    • Static electromigration analysis for on-chip signal interconnects
    • Jan
    • D. Blaauw, et al, "Static electromigration analysis for on-chip signal interconnects", IEEE Trans. on CAD, vol. 22(1), p.39, Jan, 2003.
    • (2003) IEEE Trans. on CAD , vol.22 , Issue.1 , pp. 39
    • Blaauw, D.1
  • 16
    • 70449711040 scopus 로고    scopus 로고
    • Electromigration-aware physical design of integrated circuits
    • J. Lienig, et al., "Electromigration-aware physical design of integrated circuits", IEEE International Conf. on VLSI Design, 2005.
    • (2005) IEEE International Conf. on VLSI Design
    • Lienig, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.