메뉴 건너뛰기




Volumn 22, Issue 1, 2003, Pages 39-48

Static electromigration analysis for on-chip signal interconnects

Author keywords

Circuit analysis; Circuit simulation; Computer aided design; Interconnect reliability; Physical design

Indexed keywords

APPROXIMATION THEORY; CHARGE TRANSFER; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC CONNECTORS; ELECTRIC CURRENTS; ELECTROMIGRATION; SWITCHING;

EID: 0037230705     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2002.805728     Document Type: Article
Times cited : (44)

References (19)
  • 1
    • 85023248653 scopus 로고
    • The failure of thin aluminum current-carrying strips on oxidized silicon
    • I. A. Blech and J. Sello, "The failure of thin aluminum current-carrying strips on oxidized silicon," Phys. Failure Electron., vol. 5, pp. 496-505, 1966.
    • (1966) Phys. Failure Electron. , vol.5 , pp. 496-505
    • Blech, A.1    Sello, J.2
  • 2
    • 84990733152 scopus 로고
    • Mass transport of aluminum by momentum exchange with conduction electrons
    • J. R. Black, "Mass transport of aluminum by momentum exchange with conduction electrons," in Proc. IEEE Int. Reliability Physics Symp., 1967, pp. 148-159.
    • (1967) Proc. IEEE Int. Reliability Physics Symp. , pp. 148-159
    • Black, J.R.1
  • 3
    • 0014630193 scopus 로고
    • Electromigration failure modes in aluminum metallization for semiconductor devices
    • Sept.
    • _, "Electromigration failure modes in aluminum metallization for semiconductor devices," Proc. IEEE, vol. 57, pp. 1587-1594, Sept. 1969.
    • (1969) Proc. IEEE , vol.57 , pp. 1587-1594
  • 4
    • 0025435021 scopus 로고
    • Projecting interconnect electromigration lifetime for arbitrary current waveforms
    • May
    • B. Liew, N. Cheung, and C. Hu, "Projecting interconnect electromigration lifetime for arbitrary current waveforms," in Proc. IEEE Trans. Electron. Devices, vol. 37, May 1990, pp. 1343-1351.
    • (1990) Proc. IEEE Trans. Electron. Devices , vol.37 , pp. 1343-1351
    • Liew, B.1    Cheung, N.2    Hu, C.3
  • 5
    • 0000268479 scopus 로고
    • Vacancy supersaturation model for electromigration failure under DC and pulsed DC stress
    • May
    • J.J. Clement, "Vacancy supersaturation model for electromigration failure under DC and pulsed DC stress," J. Applied Phys., vol. 91, pp. 4264-4268, May 1992.
    • (1992) J. Applied Phys. , vol.91 , pp. 4264-4268
    • Clement, J.J.1
  • 7
    • 0028413845 scopus 로고
    • An electromigration failure model for interconnects under pulsed and bidirectional current stressing
    • Apr.
    • J. Tao, N. Cheng, and C, Hu, "An electromigration failure model for interconnects under pulsed and bidirectional current stressing," IEEE Trans. Electron. Devices, vol. 41, pp. 539-545, Apr. 1994.
    • (1994) IEEE Trans. Electron. Devices , vol.41 , pp. 539-545
    • Tao, J.1    Cheng, N.2    Hu, C.3
  • 8
    • 0023218786 scopus 로고
    • Study of electromigration-induced resistance and resistance decay in Al thin film conductors
    • J. R. Lloyd and R. H. Koch, "Study of electromigration-induced resistance and resistance decay in Al thin film conductors," in Proc. IEEE Int. Reliability Physics Symp., 1987.
    • (1987) Proc. IEEE Int. Reliability Physics Symp.
    • Lloyd, J.R.1    Koch, R.H.2
  • 10
    • 0024865572 scopus 로고
    • Characterization of electromigration under bidirectional and pulsed unidirectional currents
    • J. A. Maiz, "Characterization of electromigration under bidirectional and pulsed unidirectional currents," in Proc. IEEE Int. Reliability Physics Symp., 1988, pp. 220-228.
    • (1988) Proc. IEEE Int. Reliability Physics Symp. , pp. 220-228
    • Maiz, J.A.1
  • 12
    • 0029547643 scopus 로고
    • Statistical electromigration budgeting for reliable design and verification in a 300-MHz microprocessor
    • J. Kitchin, "Statistical electromigration budgeting for reliable design and verification in a 300-MHz microprocessor," in Proc. Symp. VLSI Circuits, 1995, pp. 115-116.
    • (1995) Proc. Symp. VLSI Circuits , pp. 115-116
    • Kitchin, J.1
  • 14
  • 15
    • 0031198450 scopus 로고    scopus 로고
    • iTEM: A temperature-dependent electromigration reliability diagnosis tool
    • Aug.
    • C. C. Teng, Y.-K. Cheng, E. Rosenbaum, and S.-M. Kang, "iTEM: A temperature-dependent electromigration reliability diagnosis tool," IEEE Trans. Computer-Aided Design, vol. 16, pp. 882-893, Aug. 1997.
    • (1997) IEEE Trans. Computer-Aided Design , vol.16 , pp. 882-893
    • Teng, C.C.1    Cheng, Y.-K.2    Rosenbaum, E.3    Kang, S.-M.4
  • 18
    • 0024646120 scopus 로고
    • RELIANT: A reliability analysis tool for VLSI interconnects
    • Apr.
    • D. F. Frost and K. F. Poole, "RELIANT: A reliability analysis tool for VLSI interconnects," IEEE J. Solid-State Circuits, vol. 24, pp. 458-462, Apr. 1989.
    • (1989) IEEE J. Solid-State Circuits , vol.24 , pp. 458-462
    • Frost, D.F.1    Poole, K.F.2
  • 19
    • 0028756124 scopus 로고
    • Modeling the effective capacitance for the RC interconnect of CMOS gates
    • Dec.
    • J. Qian, S. Pullela, and L. T. Pillage, "Modeling the effective capacitance for the RC interconnect of CMOS gates," IEEE Trans. Computer-Aided Design, pp. 1526-1555, Dec. 1994.
    • (1994) IEEE Trans. Computer-Aided Design , pp. 1526-1555
    • Qian, J.1    Pullela, S.2    Pillage, L.T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.