A 3D EHL simulation of CMP: Theoretical framework of modeling

Journal of the Electrochemical Society

Volumn 152, Issue 1, 2005, Pages

  Jin, Xiaoqing ^a   Keer, Leon M ^a   Wang, Qian ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; COMPUTER SIMULATION; ELASTOHYDRODYNAMIC LUBRICATION; ITERATIVE METHODS; MATHEMATICAL MODELS; PRESSURE EFFECTS; REYNOLDS NUMBER; SEMICONDUCTOR DEVICE MANUFACTURE;

ASPERITY CONTACT; DIRECT CONTACT; ELASTIC CONTACT; WINKLER FOUNDATION MODELS;

CHEMICAL MECHANICAL POLISHING;

EID: 12744279476     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1823993     Document Type: Article

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