Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP

Journal of the Electrochemical Society

Volumn 151, Issue 3, 2004, Pages

  Doy, Toshiroh K ^a,b   Seshimo, Kiyoshi ^b   Suzuki, Keisuke ^c   Philipossian, Ara ^d   Kinoshita, Masaki ^a  

^a SAITAMA UNIVERSITY   (Japan)

^b NHK Spring Co Ltd   (Japan)

^c SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^d UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; BEARING PADS; DIELECTRIC MATERIALS; FRICTION; HYDRODYNAMICS; LSI CIRCUITS; STRENGTH OF MATERIALS; TEXTURES; TRIBOLOGY;

FLUID BEARINGS; SLURRY RETENTION;

CHEMICAL MECHANICAL POLISHING;

EID: 1842425461     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1646144     Document Type: Article

References (13)

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