Exploring compromises among timing, power and temperature in three-dimensional integrated circuits

Proceedings - Design Automation Conference

Volumn , Issue , 2006, Pages 997-1002

  Hua, Hao ^a   Mineo, Chris ^a   Schoenfliess, Kory ^a   Sule, Ambarish ^a   Melamed, Samson ^a   Jenkal, Ravi ^a   Davis, W Rhett ^a  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

3DIC; Design flow; Temperature dependency; Trade off

Indexed keywords

ELECTRIC POWER SYSTEMS; HIGH DEFINITION TELEVISION; INTERCONNECTION NETWORKS; LEAKAGE CURRENTS;

DESIGN FLOW; TEMPERATURE DEPENDENCY; THREE DIMENSIONAL INTEGRATED CIRCUITS (3DIC); TRADE OFF;

INTEGRATED CIRCUITS;

EID: 34547151747     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1146909.1147161     Document Type: Conference Paper

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