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Volumn , Issue , 2003, Pages 78-83

Full Chip Leakage Estimation Considering Power Supply and Temperature Variations

Author keywords

Leakage power; Supply voltage variation; Thermal analysis

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC BATTERIES; ELECTRIC POTENTIAL; ELECTRIC POWER DISTRIBUTION; INTEGRATED CIRCUIT LAYOUT; LEAKAGE CURRENTS; MATHEMATICAL MODELS; POLYNOMIALS; REGRESSION ANALYSIS; THERMOANALYSIS;

EID: 85088341156     PISSN: 15334678     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/871506.871529     Document Type: Conference Paper
Times cited : (11)

References (11)
  • 2
    • 0030704451 scopus 로고    scopus 로고
    • Power supply noise analysis methodology for deep-submicron vlsi chip design
    • H. Chen and D. Ling. Power supply noise analysis methodology for deep-submicron vlsi chip design. In Proceedings of DAC, 1997.
    • (1997) Proceedings of DAC
    • Chen, H.1    Ling, D.2
  • 6
    • 84962272094 scopus 로고    scopus 로고
    • Leakage power estimation for deep submicron circuits in an asic design environment
    • R. Kumar and C. P. Ravikumar. Leakage power estimation for deep submicron circuits in an asic design environment. In International Conference on VLSI Design, 2002.
    • (2002) International Conference on VLSI Design
    • Kumar, R.1    Ravikumar, C.P.2
  • 7
    • 0036949325 scopus 로고    scopus 로고
    • Full-chip sub-threshold leakage power prediction model for sub-0.18 μm cmos
    • S. Narenda and et al. Full-chip sub-threshold leakage power prediction model for sub-0.18 μm cmos. In Proceedings of ISLPED 2002, 2002.
    • (2002) Proceedings of ISLPED 2002
    • Narenda, S.1
  • 8
    • 0032025118 scopus 로고    scopus 로고
    • The development of component-level thermal compact models of a C4/cbga interconnect technology: The Motorola Powerpc 603 and Powerpc 604 Risc microprocessors
    • March
    • J. Parry, H. Rosten, and G. B. Kronmann. The development of component-level thermal compact models of a C4/CBGA interconnect technology: The Motorola PowerPC 603 and PowerPC 604 RISC microprocessors. IEEE Trans. Components, Packaging, and Manufacturing Technology. March 1998.
    • (1998) IEEE Trans. Components, Packaging, and Manufacturing Technology
    • Parry, J.1    Rosten, H.2    Kronmann, G.B.3
  • 11
    • 0034826160 scopus 로고    scopus 로고
    • Thermal-adi: A linear-time chip level dynamic thermal simulation algorithm based on alternating-direction-implicit (adi) method
    • T.-Y. Wang and C. C.-P. Chen. Thermal-adi: A linear-time chip level dynamic thermal simulation algorithm based on alternating-direction-implicit (adi) method. In International Symposium on Physical Design, 2001.
    • (2001) International Symposium on Physical Design
    • Wang, T.-Y.1    Chen, C.C.-P.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.