Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 5, 2001, Pages 871-878

  Jentzsch, Andrea ^b   Heinrich, Wolfgang ^a,b  

^a IEEE

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

Finite difference methods; Flip chip devices; MMIC multichip modules; Packaging

Indexed keywords

DETUNING; ELECTROMAGNETIC SIMULATION; FLIP CHIP INTERCONNECTS; MMIC MULTICHIP MODULES;

COMPUTER SIMULATION; ELECTRIC FIELD EFFECTS; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; FLIP CHIP DEVICES; FREQUENCY DOMAIN ANALYSIS; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES;

INTERCONNECTION NETWORKS;

EID: 0034986867     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.920143     Document Type: Article

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